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1

[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Feasibility study of fully self aligned vias for 5nm node BEOL

Murdoch, Gayle, Bommels, Jurgen, Wilson, Christopher J., Gavan, Khashayar Babaei, Le, Quoc Toan, Tokei, Zsolt, Clark, William

Année:

2017

Langue:

english

Fichier:

PDF, 432 KB

english, 2017

2

Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers

Larry Zhao, Melina Lofrano, Kristof Croes, Els Van Besien, Zsolt Tőkei, Christopher J. Wilson, Robin Degraeve, Thomas Kauerauf, Gerald P. Beyer, Cor Claeys

Journal:

Thin Solid Films

Année:

2011

Langue:

english

Fichier:

PDF, 1.14 MB

english, 2011

3

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging

Kljucar, Luka, Gonzalez, Mario, Croes, Kristof, Wolf, Ingrid De, Murdoch, Gayle, Vos, Joeri De, Bommels, Jurgen, Beyne, Eric, Tokei, Zsolt

Année:

2016

Langue:

english

Fichier:

PDF, 1.60 MB

english, 2016

4

Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers

Christopher J. Wilson, Chao Zhao, Henny Volders, Larry Zhao, Kristof Croes, Zsolt Tőkei, Gerald P. Beyer

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 794 KB

english, 2011

5

Reliability of copper low-k interconnects

Zsolt Tőkei, Kristof Croes, Gerald P. Beyer

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 615 KB

english, 2010

6

Impact of “terminal effect” on Cu electrochemical deposition: Filling capability for different metallization options

Silvia Armini, Zsolt Tokei, Henny Volders, Zaid El-Mekki, Aleksandar Radisic, Gerald Beyer, Wouter Ruythooren, Philippe M. Vereecken

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 911 KB

english, 2011

7

Analysis and characterization of a mechanical sensor to monitor stress in interconnect features

Christopher J. Wilson, Kristof Croes, Zsolt Tőkei, Gerald P. Beyer, Barry J. Gallacher, Steve J. Bull, Alton B. Horsfall, Anthony G. O'Neill

Journal:

Thin Solid Films

Année:

2010

Langue:

english

Fichier:

PDF, 1.33 MB

english, 2010

8

Study of metal barrier deposition-induced damage to porous low-k materials

Larry Zhao, Henny Volders, Mikhail Baklanov, Zsolt Tőkei, Marianna Pantouvaki, Christopher J. Wilson, Els Van Besien, Gerald P. Beyer, Cor Claeys

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 368 KB

english, 2011

9

[IEEE 2006 IEEE International Integrated Reliability Workshop Final Report - South Lake Tahoe, CA, USA (2006.10.16-2006.09.19)] 2006 IEEE International Integrated Reliability Workshop Final Report - Bias Stress Induced Conduction Mechanism Evolution in Silica Based Inter-Metal Dielectrics

Li, Yunlong, Groeseneken, Guido, Maex, Karen, Tokei, Zsolt

Année:

2006

Langue:

english

Fichier:

PDF, 4.05 MB

english, 2006

10

A Comprehensive LER-Aware TDDB Lifetime Model for Advanced Cu Interconnects

Stucchi, Michele, Roussel, Philippe J., Tokei, Zsolt, Demuynck, Steven, Groeseneken, Guido

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2011

Langue:

english

Fichier:

PDF, 1.16 MB

english, 2011

11

[IEEE 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - Phoenix, AZ, USA (2007.04.15-2007.04.19)] 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - On the Interaction Between Inter-Metal Dielectric Reliability and Electromigration Stress

Li, Yunlong, Bruynseraede, Christophe, Groeseneken, Guido, Maex, Karen, Tokei, Zsolt

Année:

2007

Langue:

english

Fichier:

PDF, 481 KB

english, 2007

12

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Line Edge Roughness (LER) correlation and dielectric reliability with Spacer-Defined Double Patterning (SDDP) at 20nm half pitch

Siew, Yong Kong, Stucchi, Michele, Versluijs, Janko, Roussel, Philippe, Kunnen, Eddy, Pantouvaki, Marianna, Beyer, Gerald P., Tokei, Zsolt

Année:

2011

Langue:

english

Fichier:

PDF, 387 KB

english, 2011

13

Phase Formation and Morphology of Nickel Silicide Thin Films Synthesized by Catalyzed Chemical Vapor Reaction of Nickel with Silane

Peter, Antony Premkumar, Meersschaut, Johan, Richard, Olivier, Moussa, Alain, Steenbergen, Johnny, Schaekers, Marc, Tőkei, Zsolt, Van Elshocht, Sven, Adelmann, Christoph

Journal:

Chemistry of Materials

Année:

2015

Langue:

english

Fichier:

PDF, 3.15 MB

english, 2015

14

Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection

Carbonell, Laureen, Holsteyns, Frank, Tőkei, Zsolt, O'Reilly, Lisa, Maex, Karen, Mertens, Paul W.

Journal:

Solid State Phenomena

Année:

2003

Fichier:

PDF, 367 KB

2003

15

[ECS 208th ECS Meeting - Los Angeles, California (October 16-October 21, 2005)] ECS Transactions - Influence of Ta(N) Metal Gate Microstructure on Its Etch Properties

Shamiryan, Denis, Paraschiv, Vasile, Tokei, Zsolt, Boullart, Werner

Année:

2006

Langue:

english

Fichier:

PDF, 696 KB

english, 2006

16

[AIP SYNCHROTRON RADIATION INSTRUMENTATION: Ninth International Conference on Synchrotron Radiation Instrumentation - Daegu (Korea) (28 May-2 June 2006)] AIP Conference Proceedings - Preliminary Hard X-ray Micro-spectroscopic Investigations on Thin-Film Ta-and-W Based Diffusion Barriers for Copper Interconnect Technology

Ablett, James M., Woicik, Joseph C., Tokei, Zsolt

Année:

2007

Langue:

english

Fichier:

PDF, 275 KB

english, 2007

17

[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Variability of quadruple-patterning interconnect processes

Baert, Rogier, Ciofi, Ivan, Wilson, Christopher J., Gonzalez, Victor Vega, Bommels, Jurgen, Tokei, Zsolt, Ryckaert, Julien, Raghavan, Praveen, Mercha, Abdelkarim, Verkest, Diederik

Année:

2015

Langue:

english

Fichier:

PDF, 177 KB

english, 2015

18

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line

Ključar, Luka, González, Mario, De Wolf, Ingrid, Croes, Kristof, Bömmels, Jürgen, Tőkei, Zsolt

Journal:

Microelectronics Reliability

Année:

2016

Langue:

english

Fichier:

PDF, 975 KB

english, 2016

19

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 24 February 2013)] Extreme Ultraviolet (EUV) Lithography IV - The need for EUV lithography at advanced technology for sustainable wafer cost

Mallik, Arindam, Naulleau, Patrick P., Vansumere, Wim, Ryckaert, Julien, Mercha, Abdelkarim, Horiguchi, Naoto, Demuynck, Steven, Bömmels, Jürgen, Zsolt, Tokei, Vandenberghe, Geert, Ronse, Kurt, Thean,

Année:

2013

Langue:

english

Fichier:

PDF, 652 KB

english, 2013

20

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation

Zahedmanesh, Houman, Gonzalez, Mario, Ciofi, Ivan, Croes, Kristof, Bömmels, Jürgen, Tőkei, Zsolt

Journal:

Microelectronics Reliability

Année:

2016

Langue:

english

Fichier:

PDF, 1.13 MB

english, 2016

21

SPIE Proceedings [SPIE Advanced Lithography - San Jose, CA (Sunday 25 February 2007)] Advances in Resist Materials and Processing Technology XXIV - A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond

Op de Beeck, Maaike, Lin, Qinghuang, Versluijs, Janko, Tőkei, Zsolt, Demuynck, Steven, De Marneffe, J.-F., Boullart, Werner, Vanhaelemeersch, Serge, Zhu, Helen, Cirigliano, Peter, Pavel, Elizabeth, Sa

Année:

2007

Langue:

english

Fichier:

PDF, 926 KB

english, 2007

22

[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - End of Cu roadmap and beyond Cu

Année:

2016

Langue:

english

Fichier:

PDF, 321.92 MB

english, 2016

23

Statistical Timing Analysis Considering Device and Interconnect Variability for BEOL Requirements in the 5-nm Node and Beyond

Huynh-Bao, Trong, Ryckaert, Julien, Tokei, Zsolt, Mercha, Abdelkarim, Verkest, Diederik, Thean, Aaron Voon-Yew, Wambacq, Piet

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Année:

2017

Langue:

english

Fichier:

PDF, 4.25 MB

english, 2017

24

Cu passivation for integration of gap-filling ultralow-k dielectrics

Zhang, Liping, de Marneffe, Jean-Francois, Lesniewska, Alicja, Verdonck, Patrick, Heylen, Nancy, Murdoch, Gayle, Croes, Kristof, Boemmels, Juergen, Tokei, Zsolt, De Gendt, Stefan, Baklanov, Mikhail R.

Journal:

Applied Physics Letters

Année:

2016

Langue:

english

Fichier:

PDF, 1.54 MB

english, 2016

25

Thickness dependence of the resistivity of platinum-group metal thin films

Dutta, Shibesh, Sankaran, Kiroubanand, Moors, Kristof, Pourtois, Geoffrey, Van Elshocht, Sven, Bömmels, Jürgen, Vandervorst, Wilfried, Tőkei, Zsolt, Adelmann, Christoph

Journal:

Journal of Applied Physics

Année:

2017

Langue:

english

Fichier:

PDF, 2.08 MB

english, 2017

26

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Ključar, Luka, González, Mario, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Murdoch, Gayle, Nolmans, Philip, De Vos, Joeri, Bömmels, Jürgen, Beyne, Eric, Tőkei, Zsolt

Journal:

Microelectronics Reliability

Année:

2017

Langue:

english

Fichier:

PDF, 3.81 MB

english, 2017

27

Initial Oxidation of a 9%CrMo- and a 12%CrMoV-Steel

Grabke, Hans Jürgen, Tökei, Zsolt, Ostwald, Carmen

Journal:

steel research international

Année:

2004

Langue:

english

Fichier:

PDF, 2.13 MB

english, 2004

28

Study of the enhanced electromigration performance of Cu(Mn) by low-frequency noise measurements and atom probe tomography

Beyne, Sofie, Arnoldi, Laurent, De Wolf, Ingrid, Tőkei, Zsolt, Croes, Kristof

Journal:

Applied Physics Letters

Année:

2017

Langue:

english

Fichier:

PDF, 3.61 MB

english, 2017

29

[IEEE 2017 International Conference on Noise and Fluctuations (ICNF) - Vilnius, Lithuania (2017.6.20-2017.6.23)] 2017 International Conference on Noise and Fluctuations (ICNF) - Demonstration of low-frequency noise measurements for studying electromigration mechanisms in advanced nano-scaled interconnects

Beyne, Sofie, Croes, Kristof, De Wolf, Ingrid, Tokei, Zsolt

Année:

2017

Langue:

english

Fichier:

PDF, 972 KB

english, 2017

30

Direct metal etch of ruthenium for advanced interconnect

Paolillo, Sara, Wan, Danny, Lazzarino, Frédéric, Rassoul, Nouredine, Piumi, Daniele, Tőkei, Zsolt

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Année:

2018

Langue:

english

Fichier:

PDF, 2.45 MB

english, 2018

31

RC Benefits of Advanced Metallization Options

Ciofi, Ivan, Roussel, Philippe J., Baert, Rogier, Contino, Antonino, Gupta, Anshul, Croes, Kristof, Wilson, Christopher J., Mocuta, Dan, Tokei, Zsolt

Journal:

IEEE Transactions on Electron Devices

Année:

2019

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2019

32

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch

Beyne, Sofie, Pedreira, Olalla Varela, De Wolf, Ingrid, Tokei, Zsolt, Croes, Kristof

Année:

2019

Langue:

english

Fichier:

PDF, 2.73 MB

english, 2019

33

Lateral solvent diffusion characterization of low k dielectric plasma damage and ALD barrier film closure

Thomas Abell, Jorg Schuhmacher, Zsolt Tokei, Youssef Travaly, Karen Maex

Journal:

Microelectronic Engineering

Année:

2005

Langue:

english

Fichier:

PDF, 156 KB

english, 2005

34

In situ X-ray diffraction study of self-forming barriers from a Cu–Mn alloy in 100 nm Cu/low-k damascene interconnects using synchrotron radiation

Christopher J. Wilson, Henny Volders, Kristof Croes, Marianna Pantouvaki, Gerald P. Beyer, Alton B. Horsfall, Anthony G. O’Neill, Zsolt Tőkei

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 417 KB

english, 2010

35

Capacitance measurements and k-value extractions of low-k films

Ivan Ciofi, Mikhail R. Baklanov, Zsolt Tőkei, Gerald P. Beyer

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2010

36

Interconnect reliability – A study of the effect of dimensional and porosity scaling

Kristof Croes, Christopher J. Wilson, Melina Lofrano, Gerald P. Beyer, Zsolt Tőkei

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 780 KB

english, 2011

37

Influence of porosity on electrical properties of low-k dielectrics

Els Van Besien, Marianna Pantouvaki, Larry Zhao, David De Roest, Mikhail R. Baklanov, Zsolt Tőkei, Gerald Beyer

Journal:

Microelectronic Engineering

Année:

2012

Langue:

english

Fichier:

PDF, 384 KB

english, 2012

38

High Quality NH2SAM (Self Assembled Monolayer) Diffusion Barrier for Advanced Copper Interconnects

Maestre Caro, Arantxa, Zhao, L., Maes, Guido, Borghs, Gustaaf, Beyer, Gerald, Tőkei, Zsolt, Armini, Silvia, Travaly, Youssef

Journal:

MRS Proceedings

Année:

2010

Langue:

english

Fichier:

PDF, 941 KB

english, 2010

39

Selective chemical vapor synthesis of Cu3Ge: Process optimization and film properties

Antony Premkumar Peter, Laureen Carbonell, Marc Schaekers, Christoph Adelmann, Johan Meersschaut, Alexis Franquet, Olivier Richard, Hugo Bender, Tokei Zsolt, Sven van Elshocht

Journal:

Année:

2013

Langue:

english

Fichier:

PDF, 1.55 MB

english, 2013

40

Size-Dependent Resistivity in Nanoscale Interconnects

Josell, Daniel, Brongersma, Sywert H., Tőkei, Zsolt

Journal:

Annual Review of Materials Research

Année:

2009

Langue:

english

Fichier:

PDF, 1.04 MB

english, 2009

41

Full reliability study of advanced metallization options for 30nm ½pitch interconnects

Croes, Kristof, Demuynck, Steven, Siew, Yong Kong, Pantouvaki, Marianna, Wilson, Christopher J., Heylen, Nancy, Beyer, Gerald P., Tőkei, Zsolt

Journal:

Microelectronic Engineering

Année:

2013

Langue:

english

Fichier:

PDF, 691 KB

english, 2013

42

Enabling interconnect scaling with Spacer-Defined Double Patterning (SDDP)

Siew, Yong Kong, Stucchi, Michele, Versluijs, Janko, Roussel, Philippe, Kunnen, Eddy, Pantouvaki, Marianna, Beyer, Gerald P., Tokei, Zsolt

Journal:

Microelectronic Engineering

Année:

2013

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2013

43

Ultrathin NiGe Films Prepared via Catalytic Solid–Vapor Reaction of Ni with GeH 4

Peter, Antony P., Opsomer, Karl, Adelmann, Christoph, Schaekers, Marc, Meersschaut, Johan, Richard, Olivier, Vaesen, Inge, Moussa, Alain, Franquet, Alexis, Zsolt, Tokei, Van Elshocht, Sven

Journal:

ACS Applied Materials & Interfaces

Année:

2013

Langue:

english

Fichier:

PDF, 2.26 MB

english, 2013

44

Growth and integration challenges for carbon nanotube interconnects

Vanpaemel, Johannes, Sugiura, Masahito, Barbarin, Yohan, De Gendt, Stefan, Tökei, Zsolt, Vereecken, Philippe M., van der Veen, Marleen H.

Journal:

Microelectronic Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 1.45 MB

english, 2014

45

On-chip optical interconnects versus electrical interconnects for high-performance applications

Stucchi, Michele, Cosemans, Stefan, Van Campenhout, Joris, Tőkei, Zsolt, Beyer, Gerald

Journal:

Microelectronic Engineering

Année:

2013

Langue:

english

Fichier:

PDF, 2.68 MB

english, 2013

46

Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

Swerts, Johan, Siew, Yong-Kong, Van Besien, Els, Barbarin, Yohan, Opsomer, Karl, Bömmels, Jürgen, Tőkei, Zsolt, Van Elshocht, Sven

Journal:

Microelectronic Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2014

47

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Mechanical stability of Cu/low-k BEOL interconnects

Gonzalez, Mario, Vanstreels, Kris, Cherman, Vladimir, Croes, Kristof, Kljucar, Luka, De Wolf, Ingrid, Tokei, Zsolt

Année:

2014

Langue:

english

Fichier:

PDF, 2.21 MB

english, 2014

48

[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Interconnects scaling challenge for sub-20nm spin torque transfer magnetic random access memory technology

Min, Tai, Tokei, Zsolt, Kar, Gouri Sankar, Coseman, Stefan, Bekaert, Joost, Raghavan, Praveen, Cornelissen, Sven, Xu, Kaidong, Souriau, Laurent, Radisic, Dunja, Swerts, Johan, Tahmasebi, Taiebeh, Mert

Année:

2014

Langue:

english

Fichier:

PDF, 474 KB

english, 2014

49

[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Electrical improvement of CNT contacts with Cu damascene top metallization

van der Veen, Marleen H., Barbarin, Yohan, Vereecke, Bart, Sugiura, Masahito, Kashiwagi, Yusaku, Cott, Daire J., Huyghebaert, Cedric, Tokei, Zsolt

Année:

2013

Langue:

english

Fichier:

PDF, 942 KB

english, 2013

50

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Link between silica-metal agglomeration and high porosity ultra-low k scratch formation during Chemical Mechanical Polishing

Heylen, Nancy, Camerotto, Elisabeth, Volders, Henny, Travaly, Youssef, Vereecke, Guy, Beyer, Gerald P., Tokei, Zsolt

Année:

2010

Langue:

english

Fichier:

PDF, 496 KB

english, 2010